Enclosure for liquid submersion cooled electronics

ABSTRACT

An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.

FIELD

This disclosure relates to liquid submersion cooling of electronicsystems where electronic components are disposed within an enclosure andsubmerged within a liquid coolant that cools the electronic components.

BACKGROUND

Liquid submersion of electronics to cool the electronics through directcontact with a liquid coolant is known. Examples of liquid submersioncooling of electronics are disclosed in U.S. Pat. Nos. 7,905,106 and7,403,392 among others. Liquid submersion cooling of electronics has anumber of advantages over air cooling of electronics including increasedenergy efficiency by eliminating the need for fans and reducing HVACcooling; quieter operation by eliminating fan noise; use in harshenvironments since the electronics are contained in a sealed,liquid-tight enclosure that protects the electronics from humidity,salt, sand, dust and other contaminants; and high reliability byreducing or preventing thermal fatigue, corrosion and contamination ofthe electronics.

SUMMARY

An enclosure and an electronic system that uses the enclosure aredescribed. The enclosure provides improved heat removal from a coolingliquid that is circulated through the electronic system for cooling theelectronic components thereof which are submerged in the cooling liquidin direct contact therewith.

The enclosure is configured to house the electronic components, as wellas act as a heat exchanger through which the cooling liquid iscirculated to cool the cooling liquid. Since the enclosure is configuredto act as a heat exchanger, it is not necessary to circulate the coolingliquid to an external heat exchanger for cooling of the liquid. However,in some embodiments, in addition to the cooling provided by theenclosure, the cooling liquid can be circulated to an external heatexchanger for additional cooling.

The enclosure uses an arrangement of a combination of external fins onone or more walls and fluid passages formed in one or more of the wallsthrough which the cooling liquid is circulated for cooling. The fluidpassages and the external fins are preferably formed on the same wall.The fins and fluid passages can be formed on any number of walls of theenclosure.

In one embodiment, the enclosure is formed by a primary housing thatforms the majority of the enclosure and that is open at opposite ends,and end plates that close the open ends. One or more walls of theprimary housing can be provided with the external fins and the fluidpassages. In addition, external fins can be provided on one or moreedges of the end plates. In one embodiment, the external fins on the endplates can align with the external fins on the wall(s) of the primaryhousing.

The primary housing and the end plates form a liquid-tight enclosure forholding the cooling liquid and that houses the electronics that are tobe liquid submersion cooled. The electronics can be any electronicsforming any electronic system that would benefit from being liquidsubmersion cooled. In one embodiment, the electronic system is a systemthat is used in a harsh environment and that has challenging thermaldissipation needs.

In one embodiment, a circulation system circulates the cooling liquid inthe electronic system, with the circulation system being configured todirect the cooling liquid through the fluid passages in the wall(s) ofthe primary housing. In one embodiment, the circulation system caninclude a pump that is part of the electronic system so that the coolingliquid remains within the enclosure. In another embodiment, the pump ofthe circulation system is external to the electronic system so that thecooling liquid is circulated outside of the enclosure for cooling beforebeing returned back into the enclosure.

DRAWINGS

FIG. 1 is a perspective view of one embodiment of an electronic systemincorporating the enclosure described herein.

FIG. 2 is an exploded front perspective view of the enclosure of theelectronic system of FIG. 1 illustrating the components thereof.

FIG. 3 is an exploded rear perspective view of the enclosure of theelectronic system of FIG. 1 illustrating the components thereof.

FIG. 4 is another exploded view of the electronic system of FIG. 1.

FIG. 5 is a perspective view of the primary housing of the enclosure.

FIG. 6 illustrates how the sealing gasket at one end of the primaryhousing seats on the primary housing.

FIG. 7 illustrates another embodiment of the pump side end plate.

FIG. 8 is a view similar to FIG. 7 but with the sealing gasket in place.

FIG. 9 is an exploded view of another embodiment of an electronic systemincorporating an enclosure described herein.

FIGS. 10A, 10B, 10C and 10D are top/bottom end views of differentembodiments of primary housings of the enclosure with the electroniccomponents removed.

FIGS. 11 and 12 are similar to FIGS. 3 and 2, respectively, showing anembodiment of flow paths through the enclosure.

DETAILED DESCRIPTION

With reference initially to FIG. 1, an example of an electronic system10 incorporating an enclosure 12 described herein is illustrated. Theelectronic system 10 utilizes liquid submersion cooling of electroniccomponents that are disposed within the enclosure 12. The enclosure 12forms a liquid tight housing that houses the electronics components andthe cooling liquid. The electronic components can be any electroniccomponents forming any electronic system that would benefit from beingliquid submersion cooled. In one embodiment, the electronic system 10can be a system that is used in a harsh environment, such as in anenvironment where the system 10 is exposed to sand, high humidity, saltwater, and other environmental challenges, and where the system 10 haschallenging thermal dissipation needs.

The enclosure provides improved heat removal from a cooling liquid thatis circulated through the electronic system for cooling the electroniccomponents thereof which are submerged in the cooling liquid in directcontact therewith. Examples of liquid submersion cooling of electronicsare disclosed in U.S. Pat. Nos. 7,905,106 and 7,403,392, which areincorporated herein by reference.

The cooling liquid used to submerge the electronic components can be,but is not limited to, a dielectric liquid. The cooling liquid can besingle phase or two-phase. In one embodiment, the cooling liquid has ahigh enough thermal transfer capability to handle the amount of heatbeing generated by the submerged electronic components so that thecooling liquid does not change state. Enough of the cooling liquid ispresent in the enclosure 12 in order to submerge the heat generatingcomponents that one wishes to submerge. So in some instances the coolingliquid may fill substantially the entire enclosure 12, while in otherinstances the cooling liquid may only partially fill the enclosure 12.

Returning to FIG. 1, the system 10 can include one or more inputs 14through which electrical power and/or data can be input into theenclosure 12. The system 10 can also include one or more outputs 16through which electrical power and/or data can be output from theenclosure 12. In one embodiment, the input 14 can input electrical powerand electrical power and/or data is output via the output 16. In anotherembodiment where electrical energy to power the system 10 is provided byone or more batteries internal to the enclosure 12, data can be inputvia the input 14, and electrical power and/or data is output via theoutput 16. Other inputs and outputs are possible depending upon thefunction and purpose of the system 10 and the electronic components inthe enclosure 12.

With reference to FIGS. 2-6, the enclosure 12 includes a primary housing20, an end plate 22 at one end, a sealing gasket 24 for sealing betweenthe primary housing 20 and the end plate 22, an end plate 26 at theopposite end, and a sealing gasket 28 for sealing between the primaryhousing 20 and the end plate 26.

With reference primarily to FIG. 5 along with FIG. 10A, the primaryhousing 20 is generally rectangular in configuration and has a pluralityof walls 30 a, 30 b, 30 c, 30 d defining a substantially hollow, openinterior space 32, a first open end 34, and a second open end 36(visible in FIG. 3). Each wall 30 a-d has a thickness T defined betweenan interior surface 38 and an exterior surface 40 thereof.

A plurality of electronic components 42, at least some of which are heatgenerating, are disposed in the interior space 32. The type ofelectronic components 42 used depends upon the intended construction andfunction of the electronic system 10. In one embodiment, the electroniccomponents 42 are disposed on a circuit board 44 that is supportedwithin the interior space 32 by the walls 30 b, 30 d so that the circuitboard 44 is adjacent and substantially parallel to the wall 30 a and theelectronic components are generally positioned between the circuit board44 and the wall 30 c.

In use, cooling liquid (not illustrated) partially or completely fillsthe interior space 32 submerging the electronic components 42 that onewishes to submersion cool using the cooling liquid.

With continued reference to FIG. 5 along with FIG. 10A, one or more ofthe walls 30 a-d includes a combination of a plurality of heatdissipating fins 50 formed on the exterior surface 40 thereof, and aplurality of fluid passages 52 formed in the thickness T of the wallthereof between the interior surface 38 and the exterior surface 40. Thefluid passages 52 are arranged generally between base ends of the fins50 and the interior surface 38.

In use, the cooling liquid is circulated through the fluid passages 52to cool the cooling liquid after the cooling liquid has exchanged heatwith the electronic components 42. The heat from the cooling liquid istransferred through the material forming the wall(s) of the primaryhousing 20 to the fins 50. Heat is then dissipated from the fins 50 intothe ambient air. If desired, heat dissipation from the fins 50 can beenhanced by employing one or more fans (not shown) to direct air flowover the fins 50.

The construction and arrangement of the fins 50 and the fluid passages52, and which walls 30 a-d they are provided on, can vary based on anumber of factors including, but not limited to, the cooling that onewishes to achieve, the type of electronic components 42 used and thearrangement/location of the electronic components in the interior space32.

In the examples illustrated in FIGS. 1-9 and 10A, each of the walls 30a-d is provided with the fins 50 and the fluid passages 52. However, notall walls need to be provided with either or both of the fins 50 and thefluid passages 52. For example, FIG. 10B illustrates the walls 30 b, 30d being formed with the fins 50 but not with the fluid passages 52. InFIG. 10B, the fins 50 on the walls 30 b, 30 d can be made longer thanthe fins 50 on the walls 30 b, 30 d in FIG. 10A due to the lack of thefluid passages 52 in order to provide more surface area for heatexchange.

In addition, the arrangement of the fluid passages 52 on the walls 30a-d can vary to tailor the cooling performance. For example, as shown inFIG. 5, the fluid passages 52 in one or more of the sidewalls 30 a-d canbe grouped together into groups or clusters 52 a, 52 b, 52 c along one,some, or all of the walls. In FIG. 10A, the fluid passages 52 areillustrated as being evenly spaced from one another along the length ofone, some, or all of the walls 30 a-d. In FIG. 10B, the fluid passages52 are illustrated as being evenly spaced along the walls 30 a, 30 c. InFIG. 10C, the fluid passages 52 are illustrated as being shorter inlength (i.e. measured in the thickness T direction) than the fluidpassages in FIGS. 5, 10A, and 10B, which permits the use of longer fins50 for increase surface area for heat exchange, and the fluid passagesare evenly spaced. In FIG. 10D, the fluid passages 52 are illustrated asbeing evenly spaced, but are angled relative to the thickness Tdirection.

In the illustrated examples, the fins 50 and the fluid passages 52extend continuously from the open end 34 to the other open end 36.However, the fins 50 and the fluid passages 52 need not be continuousfrom the end 34 to the end 36. In addition, the fins 50 and the fluidpassages 52 in each wall extend substantially parallel to one anotherand extend substantially parallel to a longitudinal axis of the primaryhousing 20 that extends from the open end 34 to the open end 36.

Many other variations of the fins 50 and the fluid passages 52, andwhich of the walls 30 a-d are or are not provided with one or both, canbe utilized.

The primary housing 20 can be made from any heat conducting materialincluding plastics, metals such as aluminum, or the like. In oneembodiment, the primary housing 20 is formed by extrusion so that it isa single, unitary, one-piece construction of a material such as plasticor aluminum. An example of an extruded housing for an electronic systemis described in U.S. Pat. No. 8,089,765.

Returning to FIG. 5, the primary housing 20 can also be provided withfastener holes 54 at each end 34, 36 for receipt of fasteners used tosecure the end plates 22, 26 to the primary housing as discussed furtherbelow. In addition, in some embodiments, locator pin holes 56 can beprovided near some or all of the holes 54 at both ends 34, 36 forreceipt of locator pins discussed further below.

The end plates 22, 26 can be formed from the same heat conductingmaterial(s) as the primary housing 20, including plastics, metals suchas aluminum, or the like. In one embodiment, the end plates 22, 26 maybe formed by extrusion so that it is a single, unitary, one-piececonstruction of a material such as plastic or aluminum.

With reference to FIGS. 2-4, the end plates 22, 26 are each of generallyrectangular construction matching the generally rectangular constructionof the primary housing 20. The end plates 22, 26 are designed to bedetachably fastened to the respective open ends 34, 36 of the primaryhousing 20 to close off the open ends 34, 36. Each end plate 22, 26includes a base plate 60 and perimeter side walls 62 a, 62 b, 62 c, 62 dthat extend from the base plate 60. The base plate 60 and the side walls62 a-d create a recessed area 64 on each end plate 22, 26.

The end plates 22, 26 can be detachably fastened to the primary housing20 via any form of attachment technique. In the illustrated examples,mechanical fasteners 66 such as screws extend through holes in the endplates 22, 26 and into the holes 54 in the primary housing 20 to securethe end plates 22, 26 in position. The end plates 22, 26 can alsoinclude locator pin holes that correspond in position to the locator pinholes 56 in the primary housing 20. In one embodiment, the locator pins68 can be positioned in the locator pin holes 56 of the primary housing20 (for example as shown in FIG. 2) for fitting into the locator pinholes of the end plates 22, 26 when the end plates are attached theprimary housing. In another embodiment, the locator pins 68 can bepositioned in the locator pin holes of the end plates 22, 26 (forexample, as shown in the end plate 26 in FIG. 2) for fitting into thelocator pin holes 56 of the primary housing when the end plates areattached the primary housing. In another embodiment, the locator pins 68can be positioned in the locator pin holes 56 of the primary housing 20at one end, and positioned in the locator pin holes of the end plate atthe opposite end, for fitting into the corresponding locator pins holesof the end plate and primary housing when the end plates are attached tothe primary housing. Regardless of where the locator pins 68 areinitially located, the locator pins 68 help properly position the endplates 22, 26 relative to the primary housing 20 and also help toproperly position the sealing gaskets 24, 28 as discussed further below.

With continued reference to FIGS. 2-4, one or more of the side walls 62a-d of one or more of the end plates 22, 26 are formed with heatdissipation fins 70 on an exterior surface thereof. In the illustratedexamples, each of the side walls 62 a-d is provided with the fins 70.However, not all of the side walls 62 a-d need to be provided with thefins 70. In one embodiment, the arrangement of the fins 70 on the sidewalls 62 a-d correspond to the arrangement of the fins 50 on thecorresponding walls 30 a-d of the primary housing 20. In one embodiment,the number of the fins 70 on each of the side walls 62 a-d correspondswith the number of the fins 50 on the corresponding wall 30 a-d. Inanother embodiment, not only does the number of fins correspond, but thefins 70 can be substantially aligned with, and effectively form acontinuation of, the fins 70 on the walls 30 a-d as can be seen in FIGS.6 and 7.

With reference to FIGS. 2 and 3, in one embodiment the recessed area 64of the end plate 22 forms a return or input plenum for cooling liquidreturning through the passages 52 after being cooled. Similarly, inanother embodiment, the recessed area 64 of the end plate 26 forms anoutput plenum for cooling liquid after the liquid has exchanged heatwith the electronic components and is to be circulated through thepassages 52 for cooling.

The cooling liquid is circulated by a circulation system that includes apump 80. The pump 80 pumps cooling liquid from the interior space 32 andinto the recessed area 64 of the end plate 26. The cooling liquid isthen directed by the circulation system from the recessed area 64 intosome or all of the passages 52 at the open end 36 of the primary housing20. The cooling liquid then flows through the passages 52 where theliquid is cooled, and then flows out of the passages 52 at the open end34 and into the recessed area 64 of the end plate 22. The cooling liquidis then returned by the circulation system back into interior space 32through the open end 34.

The pump 80 can be located at any position suitable for achieving itspumping functions. In one embodiment, the pump 80 can be mounted on thesealing gasket 28 and positioned in the recessed area 64 of the endplate 26 as illustrated in FIGS. 2-4 and 7-8. In this example, the pump80 is mounted on one side of the gasket 28 and includes an inlet tube 82and a circular enlargement 84 that is disposed within a circular opening86 (see FIG. 9) in the gasket 28 in close fitting relationship therewithto mount the pump 80 on the gasket 28 and generally prevent fluidleakage between the enlargement 84 and the circular opening 86.

Referring to FIG. 3, the pump 80 includes at least one outlet 88 todirect the cooling liquid into the recessed area 64 of the end plate 26.

In another embodiment, the pump can be located in the interior space 32of the primary housing 20. In another embodiment, the pump can bemounted on the gasket 24 and pumps the cooling liquid in a directionopposite to that described above. In another embodiment, the pump is notmounted on the gasket, but is instead mounted on one of the end plates22, 26 and includes an input that extends through the sealing gasket. Instill another embodiment, more than one pump is provided.

The pump(s) 80 can have any mechanical design known in the art that issuitable for pumping the cooling liquid, for example a centrifugal pump.

The sealing gaskets 24, 28 are configured to seal the joint between theend plates 22, 26 and the open ends 36, 36 of the primary housing andprevent leakage of cooling liquid from the enclosure. The sealinggaskets 24, 28 can also be configured to control the flow of coolingliquid within the enclosure 12. The gaskets 24, 28 can be formed of anymaterial, such as rubber, silicone, metal, felt, Neoprene, fiberglass,or a plastic polymer such as polychlorotrifluoroethylene, or the like,that is suitable for performing the sealing and flow control functions.

With reference to FIGS. 2 and 3, the sealing gasket 24 comprises agenerally planar, generally rectangular sheet with through holes 90 atthe corners thereof through which the fasteners 66 extend. Additionalthrough holes 92 are provided near the through holes 90 through whichthe locator pins 68 extend. At least one fluid opening 94 is formedthrough the gasket 24 along at least one edge thereof. The fluid opening94 aligns with the outlets of the passages 52 at the open end 34 of theprimary housing 20 to allow cooling liquid that has been cooled to flowout of the passages 52, through the gasket 24 and into the recessed area64 of the end plate 22.

The number, size, and shape of the fluid opening 94 can be selected tocontrol the flow of cooling liquid out of the passages 52. For example,as illustrated in FIGS. 2 and 3, the gasket 24 has two of the openings94 along each edge of the gasket, with one of the openings 94 a having asize to permit flow out of one of the groups or clusters 52 a, 52 b, 52c of passages in the primary housing, and one of the openings 94 bhaving a larger size that permits flow out of two of the groups orclusters 52 a, 52 b, 52 c of passages in the primary housing 20.

The sealing gasket 28 has a construction that is similar to the gasket24. In particular, the gasket 28 can be a generally planar, generallyrectangular sheet with through holes 100 at the corners thereof throughwhich the fasteners 66 extend. Additional through holes 102 are providednear the through holes 100 through which the locator pins 68 extend. Atleast one fluid opening 104 is formed through the gasket 28 along atleast one edge thereof. The fluid opening 104 aligns with the inlets ofthe passages 52 at the open end 36 of the primary housing 20 to allowcooling liquid to be cooled to flow from the recessed area 64 of the endplate 26, through the gasket 28, and in to the passages 52.

The number, size, and shape of the fluid opening 104 can be selected tocontrol the flow of cooling liquid into the passages 52. For example, asillustrated in FIGS. 2 and 3, the gasket 28 has two of the openings 104along each edge of the gasket, with one of the openings 104 a having asize to permit flow into one of the groups or clusters 52 a, 52 b, 52 cof passages in the primary housing, and one of the openings 104 b havinga larger size that permits flow into two of the groups or clusters 52 a,52 b, 52 c of passages in the primary housing 20.

Other numbers, sizes, and shapes of the fluid openings 94, 104 arepossible. For example, as illustrated in FIG. 9, the gaskets 24, 28 canhave single, large openings 94, 104 along each edge thereof that alignwith all of the passages 52.

Returning to FIG. 2, the sealing gasket 24 includes a central portion106 that blocks the free flow of cooling liquid from the recessed area64 back into the interior space 32 of the primary housing 20. However,the central portion 106 is provided with a plurality of holes 108. Theholes 108 help to stratify the flow of the cooling liquid and create auniform flow field as it flows back into the interior space 32. Inaddition, the holes 108 create discrete jets of cooling liquid therefromwhich may impinge on one or more of the electronic components 42 tocreate an impingement cooling effect. The number of the holes 108, thelocation of the holes 108, the size of the holes 108, and/or theconcentration of the holes 108 can each be tailored as desired to createthe desired flow and cooling effects.

As shown in FIG. 2, the gasket 28 includes a central portion 110 that issolid and devoid of openings or holes. The solid central portion 110fluidly separates the interior space 32 from the recessed area 64 of theend plate 26 so that the cooling liquid must flow through the pump 80 inorder to reach the recessed area 64.

With reference to FIGS. 7 and 8, a modification of the end plate 26 isillustrated. In this embodiment, the outlets 88 of the pump 80 arefluidly connected to enclosed plenums 120 a, 120 b that fit within therecessed area of the end plate 26. All of the cooling liquid that flowsthrough the pump 80 is directed into the plenums 120 a, 120 b. Theplenums 120 a, 120 b are provided with one or more outlets 122, in theillustrated example two outlets 122. The outlets 122 correspond in shapeand size to corresponding ones of the fluid openings 104 a, 104 b formedin the gasket 28 so that the outlets 122 fit into and through the fluidopenings 104 a, 104 b as seen in FIG. 8. The outlets 122 help direct theflow of the cooling liquid into desired ones of the groups or clusters52 a, 52 b, 52 c of passages in the primary housing 20. The number ofoutlets 122 used, the positions of the outlets 122, and the size and/orshape of the outlets 122 can be changed as desired to alter the flowpath of the cooling liquid and thereby tailor the cooling performancethat is achieved.

In one embodiment, plenums similar to the plenums 120 a, 120 b can beused in the end plate 22 that would receive cooling liquid that isoutput from the passages 52. The plenums would include one or moreoutlets that extend through suitable openings provided in the centralportion 106 of the gasket 24 to direct the return flow of cooling liquiddirectly onto certain ones of the electronic components to impingementcool the components.

One example of a cooling operation in the electronic system 10 will nowbe described with reference to FIGS. 11 and 12, together with FIGS. 2-6.It is to be realized that other embodiments described herein operate ina similar manner. The enclosure 12 is initially assembled and filledwith cooling liquid to a desired fill level sufficient to submerge theelectronic components that one wishes to submersion cooling using thecooling liquid. To fill the enclosure 12, a suitable plugged fill portcan be provided, for example on one of the end plates 22, 26 with theplug being removable from the fill port to permit filling with thecooling liquid. Alternatively, the enclosure 12 can be orientedvertically as shown in FIGS. 1 and 6, and the upper end plate 22 removedto permit filling of the interior space.

During operation of the electronic system 10, the electronic componentsthereof generate heat. Since the electronic components are submerged inthe cooling liquid in direct contact therewith, the cooling liquid willabsorb the generated heat. To remove the absorbed heat from the coolingliquid, the cooling liquid is circulated by the pump 80. In particular,the pump 80 draws in cooling liquid through its inlet 82 and outputs theliquid into the recessed area 64 of the end plate 26 as shown by thearrows 150 in FIG. 11. The end plate 26 will absorb some portion of theheat with the external fins 70 thereof helping to dissipate the absorbedheat to ambient. The cooling liquid then flows from the recessed area 64through the fluid opening(s) 104 in the gasket 28 as shown by the arrows152 in FIGS. 11 and 12 and into the fluid passages 52 formed in thewall(s) of the primary housing 20. The wall(s) of the primary housing 20absorbs heat from the cooling liquid with the external fins 50 helpingto dissipate the absorbed heat to ambient. The cooling liquid then exitsout of the fluid passages 52 as shown by the arrows 154 in FIGS. 11 and12, and then through the fluid opening(s) 94 in the gasket 24 and intothe recessed area 64 in the end plate 22 as shown by the arrows 156. Theend plate 22 will absorb some portion of the heat with the external fins70 thereof helping to dissipate the absorbed heat to ambient. The nowcooled cooling liquid then flows through the holes 108 in the centralportion 106 of the gasket 24 back into the interior space 32 of theprimary housing as shown by the arrows 156, 158 in FIGS. 11 and 12.

The pump 80 can run continuously whenever the electronic system 10 isoperating. In another embodiment, the pump 80 can be controlled tooperate periodically, for example being turned on at periodic timeintervals and operating for a certain period of time. In still anotherembodiment, the pump 80 can be controlled intermittently, for example bybeing controlled based on the temperature of the cooling liquid and onlybeing turned on when the cooling liquid reaches a predeterminedtemperature and being turned off when the cooling liquid has been cooledback down to a predetermined temperature.

In some embodiments, the cooling liquid does not need to be circulated.Instead, the heat absorption capacity of the cooling liquid can besufficient to absorb sufficient heat, with the heat then beingdissipated from the cooling liquid via contact of the cooling liquidwith the walls of the enclosure 12 and/or the end plates 22, 26 whichdirect the heat through the walls and to the external fins where theheat is dissipated to ambient air.

The concepts described may be embodied in other forms without departingfrom the spirit or novel characteristics thereof. The examples disclosedin this application are to be considered in all respects as illustrativeand not limitative.

1. An electronic system, comprising: a primary housing having aplurality of walls defining an interior space, a first open end, and asecond open end; each wall having a thickness defined between aninterior surface and an exterior surface thereof; a first one of thewalls includes a plurality of fins formed on the exterior surfacethereof; the first wall further includes a plurality of fluid passagesformed in the thickness thereof between the interior surface and theexterior surface; heat generating electronic components disposed in theinterior space; a first plate removably attached to the primary housingat the first open end thereof and closing the first open end, the firstplate being sealed with the primary housing to prevent fluid leakagebetween the first plate and the primary housing; a second plateremovably attached to the primary housing at the second open end thereofand closing the second open end, the second plate being sealed with theprimary housing to prevent fluid leakage between the second plate andthe primary housing; a cooling liquid within the interior space andsubmerging the heat generating electronic components in direct contacttherewith; and a circulation system that circulates the cooling liquidin the electronic system, the circulation system is configured to directthe cooling liquid through the fluid passages in the first wall.
 2. Theelectronic system of claim 1, further comprising an electrical energyinput that provides electrical energy for powering the heat generatingelectronic components.
 3. The electronic system of claim 1, wherein thefluid passages extend from the first open end to the second open end,and the fins extend from the first open end to the second open end. 4.The electronic system of claim 1, further comprising a second one of thewalls includes a plurality of fins formed on the exterior surfacethereof, the second wall further includes a plurality of fluid passagesformed in the thickness thereof between the interior surface and theexterior surface thereof, and the circulation system is configured todirect the cooling liquid through the fluid passages in the second wall.5. The electronic system of claim 1, wherein each of the walls includesa plurality of fins formed on the respective exterior surface thereof,each wall further includes a plurality of fluid passages formed in thethickness thereof between the interior surface and the exterior surfacethereof, and the circulation system is configured to direct the coolingliquid through the fluid passages in each of the walls.
 6. Theelectronic system of claim 1, wherein the circulation system includes apump.
 7. The electronic system of claim 1, wherein the primary housingconsists essentially of extruded Aluminum.
 8. An enclosure for anelectronic system, comprising: a primary housing that includes aplurality of walls defining an interior space, a first open end, and asecond open end; each wall having a thickness defined between aninterior surface and an exterior surface thereof; a first one of thewalls includes a plurality of fins formed on the exterior surfacethereof; and the first wall further includes a plurality of fluidpassages formed in the thickness thereof between the interior surfaceand the exterior surface.
 9. The enclosure for an electronic system ofclaim 8, wherein the fluid passages extend from the first open end tothe second open end, and the fins extend from the first open end to thesecond open end.
 10. The enclosure for an electronic system of claim 8,further comprising a second one of the walls includes a plurality offins formed on the exterior surface thereof, and the second wall furtherincludes a plurality of fluid passages formed in the thickness thereofbetween the interior surface and the exterior surface thereof.
 11. Theenclosure for an electronic system of claim 8, wherein each of the wallsincludes a plurality of fins formed on the respective exterior surfacethereof, and each wall further includes a plurality of fluid passagesformed in the thickness thereof between the interior surface and theexterior surface thereof.
 12. The enclosure for an electronic system ofclaim 8, wherein the primary housing consists essentially of extrudedAluminum.